Semiconductor Assembly, Inspection & Handling Automation Equipment
JSI Systems designs and builds automation equipment for semiconductor assembly, packaging and test. Since 1991 we have engineered vision inspection, material handling and process systems for manufacturers in Malaysia, Singapore, China and the United States from our facility in the Bayan Lepas Free Industrial Zone, Penang.
Our range covers both front-of-line and end-of-line stages: automated optical inspection (AOI/AVI) for leadframe, die and package defects; leadframe, wafer carrier and JEDEC tray handling; die attach, dispensing and curing; laser marking for traceability; and pick-and-place for wide-bandgap (SiC/GaN) power packaging.
Every system is engineered and built in-house, then configured to your process step, throughput target and existing line equipment. Browse the range below — or tell us the process problem and our engineers will scope a system around it.
Browse by process stage
Die Coating Inspection System
Automated Leadframe Dispensing System
Leadframe Laser Marking System
WBG Pick and Place Machine
Flip-Chip Inspection System
Die Attach Curing System and Solder Reflow
3rd Optical Inspection System
Leadframe AOI System
Why manufacturers choose JSI Systems
Engineering since 1991
Built in-house
Configured to your line
