Die Coating Inspection System
Die Coating Inspection System with real-time coating coverage analysis and defect detection for semiconductor production. Supports uniformity checks and quality control.
Automated Leadframe Dispensing System
High-precision leadframe dispensing system with advanced motion control, smart material handling, and real-time process monitoring. Ensures accurate material application and stable quality for semiconductor production.
Leadframe Laser Marking System
Laser marking system designed for semiconductor leadframe applications. Provides reliable marking with automated handling and integrated verification to ensure consistency and traceability.
WBG Pick and Place Machine
WBG Pick & Place Machine with ±50μm accuracy, dual-head transfer, and full vision alignment for AMB to sinter tray applications in semiconductor packaging.
Flip-Chip Inspection System
Flip-Chip Inspection System allowing ball structure inspection. Ensures quality control in advanced flip-chip assembly processes.
Die Attach Curing System and Solder Reflow
Die Attach Curing System designed to support consistent adhesive curing in semiconductor assembly with reliable temperature control and programmable curing profiles.
3rd Optical Inspection System
3rd Optical Inspection System designed for reliable inspection in semiconductor manufacturing.
Leadframe AOI System
Advanced Automated Optical Inspection (AOI) System for semiconductor leadframe inspection featuring multi-angle detection, and comprehensive defect detection for high-volume manufacturing environments.
