Die Coating Inspection System

Our mission is simple: to deliver exceptional products and services that empower our clients to achieve their goals. We believe in fostering long-term partnerships built on trust, reliability, and mutual success.
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Die Coating Inspection System

Die Coating Inspection System with real-time coating coverage analysis and defect detection for semiconductor production. Supports uniformity checks and quality control.
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Automated Leadframe Dispensing System

High-precision leadframe dispensing system with advanced motion control, smart material handling, and real-time process monitoring. Ensures accurate material application and stable quality for semiconductor production.
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Leadframe Laser Marking System

Laser marking system designed for semiconductor leadframe applications. Provides reliable marking with automated handling and integrated verification to ensure consistency and traceability.
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WBG Pick and Place Machine

WBG Pick & Place Machine with ±50μm accuracy, dual-head transfer, and full vision alignment for AMB to sinter tray applications in semiconductor packaging.
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Flip-Chip Inspection System

Flip-Chip Inspection System allowing ball structure inspection. Ensures quality control in advanced flip-chip assembly processes.
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Automated Wafer Carrier System

Automated Wafer Carrier System designed for reliable, hands-free wafer transport in semiconductor production. Reduces contamination risk and ensures consistent transfer between process stations.
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Automated Leadframe Transfer System

Advanced Automated Leadframe Transfer System featuring precision handling, intelligent automation, and comprehensive quality control for semiconductor manufacturing. Ensures reliable leadframe transport and positioning for high-volume production.
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Die Attach Curing System and Solder Reflow

Die Attach Curing System designed to support consistent adhesive curing in semiconductor assembly with reliable temperature control and programmable curing profiles.
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3rd Optical Inspection System

3rd Optical Inspection System designed for reliable inspection in semiconductor manufacturing.
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In-line Assembly Inspection System

Advanced In-line Assembly Inspection System featuring real-time quality monitoring, AI-powered defect detection, and comprehensive process control for semiconductor manufacturing. Ensures continuous quality assurance in high-speed production environments.