The Flip-Chip Inspection System integrates leadframe tilting for side inspection of solder ball/bumps.
Key Features
Surface Inspection and precision flipping
Microscope to inspect top surface and precision flipping mechanism to allow ball structure inspection.
Visual Bump Assessment Capability
Angles inspection under a microscope, operators can visually assess the condition of solder bumps.
Advanced Alignment Verification
Precision alignment measurement system validates die placement accuracy and substrate registration. Automated analysis ensures proper bump-to-pad alignment and identifies potential connection issues.
Benefits
Superior Quality Assurance
The system supports efficient operator based inspection of flip chip assemblies.
Enhanced Process Control
Leadframe aligns precisely at predefined positions, ensuring repeatable inspection angles and locations.
Production Efficiency
High-speed inspection capabilities match advanced packaging production requirements. Automated handling and analysis minimize inspection time while maintaining comprehensive quality control.
Applications
Advanced Packaging
Specialized inspection capabilities for various flip-chip configurations including fine-pitch arrays and high-density interconnects. Supports emerging packaging technologies and advanced assembly processes.
High-Performance Computing
Enhanced inspection for high-performance computing components requiring precise bump connections and critical alignment tolerance. Supports advanced processor and memory package inspection.
Automotive Electronics
Comprehensive inspection capabilities meeting stringent automotive quality requirements. Ensures reliable validation of safety-critical electronic components.
Frequently Asked Questions (FAQ)
Contact Us
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