The Die Coating Inspection System supports semiconductor manufacturers in verifying coating coverage and identifying surface defects. It uses optical imaging and automated analysis to ensure consistent coating application across the die. Built for both inline and standalone setups, the system helps improve process reliability and reduce defects.
Key Features
Advanced Coating Analysis
High-resolution imaging is used to detect areas with incomplete or inconsistent coating. This includes edge misses, uncovered zones, and surface contamination.
Surface Coverage Evaluation
The system inspects coating coverage using high-resolution imaging to detect missed areas, thin spots, and edge inconsistencies
Automated Defect Recognition
The system uses rule-based image processing to identify common coating issues such as voids, streaks, edge defects, and foreign particles. Inspection parameters can be tuned based on coating type and application requirements.
Benefits
Consistent Coverage
Detects coating gaps and uneven application before they affect downstream processes.
Fewer Defects
Early detection reduces rework and scrap.
Stable Process Control
Supports visual inspection feedback to help operators maintain quality.
Applications
Semiconductor Processing
Supports coating inspection for dielectric layers, photoresist films, and protective coatings. Compatible with wafer and die-level applications..
Research and Development
Useful for evaluating new coating materials, validating process changes, and supporting lab-scale to pilot production.
Frequently Asked Questions (FAQ)
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